Title :
The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package
Author :
Poshtan, Emad A. ; Rzepka, S. ; Wunderle, B. ; Silber, C. ; von Bargen, T. ; Michel, Bruno
Author_Institution :
Dept. Micro Mater. Center, Fraunhofer Inst. for Electron. Nano Syst. ENAS, Chemnitz, Germany
Abstract :
In this paper we examine the influence of different characteristics of TQFP (thin quad flat package) components on package behavior by simulation and experiment. The varied parameters are the package dimensions, rate-dependent material properties such as viscoelasticity and cure shrinkage and external boundary conditions.
Keywords :
curing; electronics packaging; shrinkage; thermomechanical treatment; viscoelasticity; TQFP package; external boundary condition; geometrical characteristics; rate-dependent material property; shrinkage; thermomechanical behavior; thin quad flat package; viscoelasticity; Compounds; Finite element analysis; Material properties; Stress; Temperature; Temperature measurement;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507065
