DocumentCode
2032880
Title
The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package
Author
Poshtan, Emad A. ; Rzepka, S. ; Wunderle, B. ; Silber, C. ; von Bargen, T. ; Michel, Bruno
Author_Institution
Dept. Micro Mater. Center, Fraunhofer Inst. for Electron. Nano Syst. ENAS, Chemnitz, Germany
fYear
2012
fDate
5-7 Dec. 2012
Firstpage
131
Lastpage
135
Abstract
In this paper we examine the influence of different characteristics of TQFP (thin quad flat package) components on package behavior by simulation and experiment. The varied parameters are the package dimensions, rate-dependent material properties such as viscoelasticity and cure shrinkage and external boundary conditions.
Keywords
curing; electronics packaging; shrinkage; thermomechanical treatment; viscoelasticity; TQFP package; external boundary condition; geometrical characteristics; rate-dependent material property; shrinkage; thermomechanical behavior; thin quad flat package; viscoelasticity; Compounds; Finite element analysis; Material properties; Stress; Temperature; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location
Singapore
Print_ISBN
978-1-4673-4553-8
Electronic_ISBN
978-1-4673-4551-4
Type
conf
DOI
10.1109/EPTC.2012.6507065
Filename
6507065
Link To Document