An adhesion strength measurement method for particle transfer and assembly in dry environment

Author

Wang, Sho-Fu ; Lin, Yen-Ting ; Lin, Yan-Bo ; Wang, Kerwin

Author_Institution

Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua, Taiwan

fYear

2012

fDate

5-8 March 2012

Firstpage

355

Lastpage

358

Abstract

This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber^® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.

Keywords

adhesion; mechanical testing; mechanical variables measurement; microassembling; polymers; solders; PDMS; ReproRubber; adhesion strength measurement method; dry environment; material properties; micro solder ball; noncontact method; particle assembly; particle transfer; polydimethylsiloxane; polymethylhylhydrogen; Assembly; Atmospheric measurements; Nanoelectromechanical systems; Optical imaging; Particle measurements; Semiconductor device measurement; Substrates; PDMS; adhesion; adhesive strength; assembly; flip-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on

Conference_Location

Kyoto

Print_ISBN

978-1-4673-1122-9

Type

conf

DOI

10.1109/NEMS.2012.6196792

Filename

6196792