DocumentCode :
2033114
Title :
An analytical approach to building a technology development envelope (TDE) for roadmapping of emerging technologies
Author :
Gerdsri, Nathasit
fYear :
2005
fDate :
31 July-4 Aug., 2005
Firstpage :
123
Lastpage :
135
Keywords :
Analytical models; Companies; Electronics cooling; Government; Joining processes; Paper technology; Predictive models; Technological innovation; Technology forecasting; Technology management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Technology Management: A Unifying Discipline for Melting the Boundaries
Print_ISBN :
1-890843-11-3
Type :
conf
DOI :
10.1109/PICMET.2005.1509682
Filename :
1509682
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2033114
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