DocumentCode
2033160
Title
Possible mechanism of superior partial-discharge resistance of polyamide nanocomposites
Author
Fuse, N. ; Kozako, M. ; Tanaka, T. ; Murase, S. ; Ohki, Y.
Author_Institution
Waseda Univ., Shinjuku, Japan
fYear
2004
fDate
17-20 Oct. 2004
Firstpage
322
Lastpage
325
Abstract
The dielectric properties of polyamide nanocomposites were examined, focusing especially on their resistance against partial discharges. The paper compares the surface roughness caused by partial discharges and that caused by exposure to plasmas, between polyamide with and without inorganic nanofillers. From X-ray diffraction spectroscopy, it was confirmed that the nanofillers are rearranged in parallel with their surfaces with a mutual distance around 1 nm after the nanocomposite was subjected to partial discharges. Such ordered arrangement of nanofillers should contribute to the high durability against partial discharges in polyamide nanocomposites, in addition to the effects of the presence of mica, high crystallinity, and strong ionic interaction at mica/resin interfaces. Furthermore, the result of a preliminary attempt to detect the structural change through observation of photoluminescence spectra is also reported.
Keywords
X-ray diffraction; composite insulating materials; composite material interfaces; filled polymers; mica; nanocomposites; partial discharges; photoluminescence; 1 nm; Al2O3-K2O-SiO2; X-ray diffraction spectroscopy; crystallinity; dielectric properties; durability; inorganic nanofillers; mica/resin interface ionic interaction; ordered nanofiller arrangement; parallel nanofiller surface mutual distance; partial discharges; partial-discharge resistance mechanism; photoluminescence spectra; plasma exposure; polyamide nanocomposites; structural change; surface roughness; Dielectrics; Nanocomposites; Partial discharges; Plasma properties; Plasma x-ray sources; Rough surfaces; Surface discharges; Surface resistance; Surface roughness; X-ray diffraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
Print_ISBN
0-7803-8584-5
Type
conf
DOI
10.1109/CEIDP.2004.1364253
Filename
1364253
Link To Document