Title :
The new high voltage level up shifter for HVIC
Author :
Kim, J.J. ; Kim, M.H. ; Kim, S.L. ; Jeon, C.K. ; Choi, Y.S. ; Kang, H.S. ; Song, C.S.
Author_Institution :
New Technol. Dev. Team, Fairchild Semicond., Kyonggi, South Korea
Abstract :
A new high voltage level up shifter for high-voltage integrated circuits (HVIC) is presented that combines the optimized shape of a high doping concentration layer (N+ buried layer) and low doping isolation. In order to realize the high voltage level up shifter for HVIC, not only the P-doping level for isolation area but also the shape of N+ buried layer is very important. In P-doping level, it is hard to find the optimized condition. If the doping level is higher than proper condition, the breakdown voltage is lower than 600 V. In the opposite case, there is leakage currents between active to active area. After several experiments, one can find the optimized condition for P- isolation-around 8E12 ion/cm2. Under the optimized Pisolation condition, the shape of the N+ buried layer decides the breakdown voltage of the level up shifter. According to experimental result, as the edge radius of the N+ buried layer increases from 0 μm to 100 μm, the breakdown voltage of the level up shifter increases from 355 V to 645 V under the same vertical structure and process conditions.
Keywords :
integrated circuit measurement; integrated circuit testing; power integrated circuits; semiconductor device breakdown; semiconductor doping; 0 to 100 micron; 355 to 645 V; HV IC; N+ buried layer; P-doping level; breakdown voltage; doping isolation; high doping concentration layer; high-voltage integrated circuits; high-voltage level up shifter; leakage currents; process conditions; vertical structure; Breakdown voltage; Circuits; Isolation technology; Leakage current; Low voltage; Semiconductor device doping; Shape; Switched-mode power supply; Switches; Voltage control;
Conference_Titel :
Power Electronics Specialists Conference, 2002. pesc 02. 2002 IEEE 33rd Annual
Print_ISBN :
0-7803-7262-X
DOI :
10.1109/PSEC.2002.1022523