Title :
Yield Improvement Using Fail Signature Detection Algorithm (FSDA)
Author :
Inani, Anand ; Burch, Richard ; Kim, Joseph ; Stine, Brian
Author_Institution :
PDF Solutions Inc., San Jose, CA
Abstract :
An effective yield ramp methodology is demonstrated using fail signature detection algorithm (FSDA). Wafers with similar yield spatial patterns are grouped together to find stronger correlations to equipment data. Many signals that would have been missed otherwise were found leading to significant yield improvement
Keywords :
failure analysis; inspection; integrated circuit yield; fail signature detection algorithm; yield ramp methodology; yield spatial patterns; Clustering algorithms; Clustering methods; Detection algorithms; History; Logic; Manufacturing processes; Noise reduction; Probability; Semiconductor device manufacture; Signal analysis;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638757
