DocumentCode :
2033366
Title :
Three-dimensional digital microfluidics and applications
Author :
Wang, Gary ; Teng, Daniel ; Fan, Shih-Kang
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Saskatchewan, Saskatoon, SK, Canada
fYear :
2012
fDate :
5-8 March 2012
Firstpage :
415
Lastpage :
418
Abstract :
Digital microfluidics, by the electrowetting-on-dielectric (EWOD), is a promising way to manipulate biological targets like DNA, proteins, or cells in very small liquid volumes. Conventionally, digital microfluidic operations are performed on a two-dimensional electrode array. This research expands the two-dimensional conventional digital microfluidic architecture into a three-dimensional architecture. The concept relies on the possibility that back and forth motions between open and covered regions are possible under electrowetting actuation. Two face-to-face plates based on “microelectrode dot array” (MEDA) architecture form the foundation of the two-layer microfluidic operations and a dual open/covered hybrid design adds the inter-layer microfluidic connection to complete the three-dimensional system. By combining the advantages of the open/covered systems, a three-dimensional digital microfluidics may achieve better droplet routing capabilities and fit more functions into a given footprint.
Keywords :
bioMEMS; electrochemistry; microactuators; microelectrodes; microfluidics; wetting; 3D digital microfluidics; 3D microfluidic architecture; DNA; EWOD; MEDA architecture; biological target manipulation; cells; digital microfluidic operations; droplet routing capabilities; dual open-covered hybrid design; electrowetting actuation; electrowetting on dielectric; interlayer microfluidic connection; microelectrode dot array; proteins; two layer microfluidic operations; Reliability; EWOD; MEDA; microfluidics; three-dimensional;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-1122-9
Type :
conf
DOI :
10.1109/NEMS.2012.6196807
Filename :
6196807
Link To Document :
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