DocumentCode
2033442
Title
Development of a Shock & Vibration Spec for 300mm Wafer AMHS Handling
Author
Steele, Jay ; Biswas, Tamal
Author_Institution
AMHS Pathfinding & Dev., Intel Corp., Chandler, AZ
fYear
2006
fDate
22-24 May 2006
Firstpage
245
Lastpage
250
Abstract
In this work, a technique is presented for establishing and verifying safe vibration and shock limits for preventing cross-slotting of 300mm wafers in FOUPs during AMHS handling. This technique includes establishing the safe limits using a shaker table, calibrating these limits for a particular portable accelerometer, and then using this portable accelerometer to check an AMHS for compliance to these limits
Keywords
accelerometers; materials handling; semiconductor device manufacture; vibrations; 300 mm; accelerometer; automated material handling systems; cross-slotting; front opening unified pod; safe vibration; shaker table; shock limits; wafer AMHS handlings; Acceleration; Accelerometers; Cost function; Electric shock; Industrial engineering; Manufacturing automation; Materials handling; Semiconductor device manufacture; Throughput; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
1-4244-0254-9
Type
conf
DOI
10.1109/ASMC.2006.1638762
Filename
1638762
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