Title :
Development of a Shock & Vibration Spec for 300mm Wafer AMHS Handling
Author :
Steele, Jay ; Biswas, Tamal
Author_Institution :
AMHS Pathfinding & Dev., Intel Corp., Chandler, AZ
Abstract :
In this work, a technique is presented for establishing and verifying safe vibration and shock limits for preventing cross-slotting of 300mm wafers in FOUPs during AMHS handling. This technique includes establishing the safe limits using a shaker table, calibrating these limits for a particular portable accelerometer, and then using this portable accelerometer to check an AMHS for compliance to these limits
Keywords :
accelerometers; materials handling; semiconductor device manufacture; vibrations; 300 mm; accelerometer; automated material handling systems; cross-slotting; front opening unified pod; safe vibration; shaker table; shock limits; wafer AMHS handlings; Acceleration; Accelerometers; Cost function; Electric shock; Industrial engineering; Manufacturing automation; Materials handling; Semiconductor device manufacture; Throughput; Vibrations;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638762
