DocumentCode
2033499
Title
Comparative study of low-leakage SRAM structures using 90nm CMOS technology
Author
Domingo, Marie Elma B ; Ostia, Fritzel I. ; Reas, Rosario M. ; Alvarez, Anastacia B. ; Alarcon, Louis P.
Author_Institution
Electr. & Electron. Eng. Inst., Univ. of the Philippines, Diliman, Philippines
fYear
2010
fDate
21-24 Nov. 2010
Firstpage
2352
Lastpage
2355
Abstract
In this paper, we compared two innovations in SRAM structures, the 7T and 8T structures, over the conventional 6T structure. These two structures aim to bring down the total leakage as it becomes one of the limiting factors in submicron design. The three structures were simulated in HSPICE using the 90nm CMOS models under three varying conditions: Typical (1V, 25°C), Best (1.1V, -40°C) and Worst (0.9V, 125°C). Using the simulation results, the three were compared based on the following metrics: leakage current, static noise margin (SNM) and read and write performance. The 8T structure exhibits reduced gate tunneling current by 47.4% and 35.2%, and 83.39% and 97.73% lower in total leakage current than 6T and 7T respectively. The simulation results for SNM also shows that the structure has the greatest improvement by 1.31 times compared to 6T and 7T. For the read `0´ operation, 7T and 8T show a degradation performance by 60.8% and 18.1% and also a reduced performance during a write `1´ operation by 1.5% and 22% respectively compared to a 6T structure. But for a write `0´ operation, 7T and 8T increased their performance by 17.35% and 13.3% respectively compared to 6T.
Keywords
CMOS digital integrated circuits; SRAM chips; leakage currents; 6T structure; 7T structure; 8T structure; CMOS technology; HSPICE; leakage current; low-leakage SRAM structures; size 90 nm; static noise margin; submicron design; temperature -40 degC; temperature 125 degC; temperature 25 degC; voltage 0.9 V; voltage 1 V; voltage 1.1 V;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2010 - 2010 IEEE Region 10 Conference
Conference_Location
Fukuoka
ISSN
pending
Print_ISBN
978-1-4244-6889-8
Type
conf
DOI
10.1109/TENCON.2010.5685853
Filename
5685853
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