DocumentCode :
2033564
Title :
Difference in surface degradation due to partial discharges between polyamide nanocomposite and microcomposite [electrical insulation applications]
Author :
Kozako, Masahiro ; Kido, R. ; Fuse, Norikazu ; Ohki, Yoshimichi ; Okamoto, Tatsuki ; Tanaka, Toshikatsu
Author_Institution :
Waseda Univ., Kitakyushu, Japan
fYear :
2004
fDate :
17-20 Oct. 2004
Firstpage :
398
Lastpage :
401
Abstract :
Partial discharge (PD) degradation was investigated to compare polyamide nanocomposites with two kinds of polyamide microcomposites. Such materials were exposed to PDs under the IEC(b) electrode configuration for evaluation of PD resistance. Comparisons were made as to the surface roughness using a scanning electron microscope, an atomic force microscope, and a mechanical surface profilometer. It is concluded that the polyamide nanocomposite is more resistant to PDs than microcomposites, and that nano-effects would work against PD degradation. The nano-effects include filler-matrix bonding, inter-filler space, morphology, and mesoscopic interaction.
Keywords :
atomic force microscopy; composite insulating materials; filled polymers; mesoscopic systems; nanocomposites; partial discharges; plastics; scanning electron microscopy; surface roughness; surface topography measurement; atomic force microscopy; electrical insulation; filler-matrix bonding; interfiller space; mechanical surface profilometry; mesoscopic interaction; morphology; nanoeffects; partial discharge resistance; polyamide microcomposite; polyamide nanocomposite; polymer nanocomposites; scanning electron microscopy; surface degradation; surface roughness; Atomic force microscopy; Degradation; Dielectrics and electrical insulation; Partial discharges; Rough surfaces; Scanning electron microscopy; Surface discharges; Surface morphology; Surface resistance; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
Print_ISBN :
0-7803-8584-5
Type :
conf
DOI :
10.1109/CEIDP.2004.1364271
Filename :
1364271
Link To Document :
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