First Look at Across-chip Performance Variation Using Non-Contact, Performance-Based Metrology

Author

Babazadeh, Majid ; Estabil, José ; Borot, Bertrand ; Johnson, Gloria ; Pakdaman, Nader ; Doedel, Wim ; Vickers, James ; Steinbrueck, Gary ; Galvier, Jean

Author_Institution

-Metrix, Inc., Sunnyvale, CA

fYear

2006

fDate

22-24 May 2006

Firstpage

278

Lastpage

283

Abstract

We report on the first non-contact, non-destructive performance measurements of embedded ring oscillators. Measurements are made on inside the die active area as early as metal 1. A 90nm logic CMOS technology was used for this work. We have measured residual across-field performance variation separate from and of opposite sense to wafer uniformity. This effect cannot be extrapolated from scribe measurements

Keywords

CMOS logic circuits; design for manufacture; integrated circuit testing; nondestructive testing; oscillators; 90 nm; across-chip linewidth variation; across-chip variation; design for manufacture; embedded ring oscillators; in-field uniformity; in-line metrology; logic CMOS technology; noncontact performance-based metrology; noncontact probe; Area measurement; Circuit testing; Design for manufacture; Electric variables measurement; Logic testing; Manufacturing; Metrology; Position measurement; Ring oscillators; Semiconductor device measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE

Conference_Location

Boston, MA

ISSN

1078-8743

Print_ISBN

1-4244-0254-9

Type

conf

DOI

10.1109/ASMC.2006.1638768

Filename

1638768