DocumentCode
2033636
Title
Stress analysis of metal seal ring AlN packages
Author
Jones, W.K. ; Jiang, W. ; Harshbarger, R.W. ; Zhuge, R.
Author_Institution
Dept. of Mech. Eng., Florida Int. Univ., Miami, FL, USA
fYear
1991
fDate
11-16 May 1991
Firstpage
203
Lastpage
209
Abstract
The static response of the molybdenum/AlN seal ring structure, subjected to uniform cooling (or heating), is evaluated by finite-element analysis, and results are compared with those of the widely used Kovar/Al2O3 combination. Results have shown that within the main portion of the seal ring structure (0⩽x ⩽0.85l ), shear stress and transverse stress are close to zero and can be neglected when compared to the level of longitudinal stress. However, near the ends, the shear stress and transverse stress can no longer be neglected, and the complicated stress distribution at the end area has far exceeded the results of classical bending theory, especially for the non-zero transverse stress
Keywords
aluminium compounds; cooling; finite element analysis; molybdenum; packaging; stress analysis; Mo-AlN; finite-element analysis; metal seal ring; shear stress; static response; stress analysis; transverse stress; uniform cooling; Ceramics; Electronic packaging thermal management; Multichip modules; Seals; Semiconductor device packaging; Silicon; Thermal conductivity; Thermal expansion; Thermal stresses; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-0012-2
Type
conf
DOI
10.1109/ECTC.1991.163877
Filename
163877
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