• DocumentCode
    2033636
  • Title

    Stress analysis of metal seal ring AlN packages

  • Author

    Jones, W.K. ; Jiang, W. ; Harshbarger, R.W. ; Zhuge, R.

  • Author_Institution
    Dept. of Mech. Eng., Florida Int. Univ., Miami, FL, USA
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    203
  • Lastpage
    209
  • Abstract
    The static response of the molybdenum/AlN seal ring structure, subjected to uniform cooling (or heating), is evaluated by finite-element analysis, and results are compared with those of the widely used Kovar/Al2O3 combination. Results have shown that within the main portion of the seal ring structure (0⩽x⩽0.85l), shear stress and transverse stress are close to zero and can be neglected when compared to the level of longitudinal stress. However, near the ends, the shear stress and transverse stress can no longer be neglected, and the complicated stress distribution at the end area has far exceeded the results of classical bending theory, especially for the non-zero transverse stress
  • Keywords
    aluminium compounds; cooling; finite element analysis; molybdenum; packaging; stress analysis; Mo-AlN; finite-element analysis; metal seal ring; shear stress; static response; stress analysis; transverse stress; uniform cooling; Ceramics; Electronic packaging thermal management; Multichip modules; Seals; Semiconductor device packaging; Silicon; Thermal conductivity; Thermal expansion; Thermal stresses; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163877
  • Filename
    163877