Title :
Characterization of thermally conductive underfill materials for high performance flip-chip applications
Author :
Chew, Marko ; Mian Zhi Ding ; Wai, E. ; Ser Choong Chong ; Rao, V. Srinivasa ; Rhee, Min Woo Daniel
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
In this paper, characterization of 3 types of underfill for high performance applications has been presented. Characterizations of underfill materials such as adhesion testing, contact angle measurement on different surfaces, filler size distribution were conducted to understand the underfill materials. The adhesion test results revealed that failure is mainly mixed mode, which is the failure between bulk underfill failure and interfacial failure. The thermal conductive underfill has a wider range of filler sizes and has the most hydrophilic behavior. From the glass chip flow test, the flow behavior of the underfill could be observed, with the most thermal conductive underfill having the slowest flow. Process optimization for thermal chip and daisy chain chip for void free underfill was also carried out based on dispensing temperature and patterns.
Keywords :
adhesion; conducting materials; failure analysis; flip-chip devices; materials testing; thermal conductivity; adhesion test; bulk underfill failure; glass chip flow test; high performance flip-chip applications; hydrophilic behavior; interfacial failure; mixed mode; therm conductive underfill material characterization; thermal chip optimization process; Adhesives; Flip-chip devices; Silicon; Substrates; TV; Thermal conductivity;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507093
