Die bonding in embedded substrates

Author

Oppermann, H. ; Rothermund, M. ; Jurgensen, Nils ; Yen, U. ; Essig, K.

Author_Institution

Fraunhofer IZM, Berlin, Germany

fYear

2012

fDate

5-7 Dec. 2012

Firstpage

294

Lastpage

296

Abstract

In advanced packaging processes the chips are molded after placement and the chip bonding pads need to be opened by laser drilling. In order to avoid post bond measurements and any correction of individual drilling location it is important to establish a process of high precision die bonding. We investigated the die bonding of 50 μm thin silicon chips on Cu leadframe using thin layers of Au/Sn solder and studied the assembly with respect to solder joint formation, metallurgy, mechanical strength and finally the post bond accuracy achieved.

Keywords

copper; electronics packaging; gold alloys; laser beam machining; microassembling; silicon; solders; tin alloys; advanced packaging processes; chip bonding pads; die bonding; embedded substrates; high precision die bonding process; individual drilling location; laser drilling; mechanical strength; metallurgy; post bond measurement avoidance; solder joint formation; solder thin layers; thin silicon chips; Accuracy; Bonding; Gold; Lead; Microassembly; Semiconductor device measurement; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th

Conference_Location

Singapore

Print_ISBN

978-1-4673-4553-8

Electronic_ISBN

978-1-4673-4551-4

Type

conf

DOI

10.1109/EPTC.2012.6507095

Filename

6507095