• DocumentCode
    2033796
  • Title

    Simulation of losses in hybrid opto-electronic die stack

  • Author

    Pusarla, C. ; Christou, A. ; Davis, C.

  • Author_Institution
    CALCE Electron. Packaging Res. Center, USA
  • fYear
    1994
  • fDate
    2-4 Nov 1994
  • Firstpage
    239
  • Lastpage
    241
  • Abstract
    A novel hybrid optoelectronic die stack architecture is proposed to address the interconnect problem at the multichip module level. An approach is outlined to compute the performance parameters such as diffraction loss and optical crosstalk and an example calculation is performed using real geometries
  • Keywords
    Computational geometry; Computational modeling; Computer architecture; Geometrical optics; Multichip modules; Optical computing; Optical crosstalk; Optical diffraction; Optical losses; Performance loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-2411-0
  • Type

    conf

  • DOI
    10.1109/EPEP.1994.594160
  • Filename
    594160
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2033796