Title :
Simulation of losses in hybrid opto-electronic die stack
Author :
Pusarla, C. ; Christou, A. ; Davis, C.
Author_Institution :
CALCE Electron. Packaging Res. Center, USA
Abstract :
A novel hybrid optoelectronic die stack architecture is proposed to address the interconnect problem at the multichip module level. An approach is outlined to compute the performance parameters such as diffraction loss and optical crosstalk and an example calculation is performed using real geometries
Keywords :
Computational geometry; Computational modeling; Computer architecture; Geometrical optics; Multichip modules; Optical computing; Optical crosstalk; Optical diffraction; Optical losses; Performance loss;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594160
