DocumentCode :
2033860
Title :
A low phase noise VCO in eWLB package
Author :
Starzer, Florian ; Fischer, Anath ; Knapp, Herbert ; Lachner, Rudolf ; Wojnowski, M. ; Maurer, Linus ; Stelzer, Andreas
Author_Institution :
Christian Doppler Lab. for Integrated Radar Sensors, Linz, Austria
fYear :
2012
fDate :
5-7 Dec. 2012
Firstpage :
326
Lastpage :
329
Abstract :
A chip-package co-design for a voltage controlled oscillator (VCO) designed in a 200-GHz SiGe:C technology is presented. The VCO is frequency-adjustable using a package defined inductor. An overall bandwidth of 21% supports the frequency bands for three different radar applications with a single silicon device. The VCO is accompanied by a buffer, a down-converter mixer (D-Cm) as well as a prescaler. The VCO is assembled in an embedded wafer level ball grid array (eWLB) package with its inductor in the packages fan-in area. It obtains a center frequency as high as 18GHz and achieves phase noise (PN) values of -92 dBc/Hz at 100 kHz offset frequency and an overall bandwidth of 21.7%.
Keywords :
Ge-Si alloys; ball grid arrays; carbon; inductors; mixers (circuits); phase noise; voltage-controlled oscillators; wafer level packaging; D-Cm; PN value; SiGe:C; chip-package co-design; down-converter mixer; eWLB package; embedded wafer level ball grid array package; frequency 200 GHz; frequency-adjustable; low phase noise VCO; package defined inductor; phase noise value; radar application; single silicon device; voltage controlled oscillator; Bandwidth; Electronics packaging; Inductors; Resonant frequency; Silicon; Voltage-controlled oscillators; Wafer level packaging; inductors; integrated circuit packaging; microwave oscillators; voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
Type :
conf
DOI :
10.1109/EPTC.2012.6507101
Filename :
6507101
Link To Document :
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