Development of leadframe for COL and LOC package

Author

Suzumura, T. ; Kawamura, T. ; Tubosaki, K.

Author_Institution

Hitachi Cable Ltd., Ibaraki, Japan

fYear

1991

fDate

11-16 May 1991

Firstpage

210

Lastpage

214

Abstract

The COL (chip-on-lead) structure is used for the 4-Mb DRAM, because this structure makes it possible to get a large chip into a comparatively small package. For application to the COL package; a leadframe with insulation films has been developed. To prevent the problem of bubbles in the adhesive HM-1, a nonsolvent adhesive is used. The problem of film warp is solved by dividing the sticking area of the leadframe into two parts. A novel sticking method, with two sticking stages, is developed. This obtains both a high sticking speed and high accuracy of the film position. A mass production system is established using the two-stage method. It is expected that this leadframe with film will be used for a large-scale memory IC package and QFPs (quad flat packages) with many outerleads

Keywords

DRAM chips; adhesion; packaging; COL package; DRAM; LOC package; QFPs; chip-on-lead; film warp; insulation films; large-scale memory IC package; lead-on-chip; mass production system; nonsolvent adhesive; sticking area; sticking speed; Bonding; Insulation; Integrated circuit packaging; Lab-on-a-chip; Laboratories; Semiconductor device packaging; Silicon; Temperature; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163878

Filename

163878