Environmental effects on connector reliability

Author

Koford, Stuart

Author_Institution

Koford Eng., Addison, IL, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

215

Lastpage

217

Abstract

The author examines data gathered from a multiyear in-depth analysis of signal and power connectors used in aircraft as well as connectors used on ground-based computers, flight simulators and test equipment. The equipment was from the period 1954-1986 and included a wide range of connector technologies and connector finishes including gold, silver, rhodium, and tin. All types of connectors were evaluated including circular, rectangular, card edge, ZIF, and RF connectors of both military and commercial type. Analysis of field failures was performed using SEM (scanning electron microscope) and EDX technology. Gold over nickel plating showed the best performance of all of the finishes. It shows the capability to resist corrosion even after many years, and with a nonporous nickel underplate there is no diffusion of base metals through the gold

Keywords

electric connectors; environmental testing; failure analysis; reliability; EDX technology; RF connectors; SEM; ZIF; aircraft; card edge; circular connectors; connector finishes; connector reliability; connector technologies; corrosion; field failures; flight simulators; ground-based computers; power connectors; rectangular connectors; signal connectors; test equipment; Aerospace simulation; Aircraft; Analytical models; Computational modeling; Connectors; Gold; Military computing; Nickel; Scanning electron microscopy; Signal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163879

Filename

163879