Title :
Analysis of signal integrity(SI) robustness in through-silicon interposer (TSI) interconnects
Author :
Weerasekera, Roshan ; Cubillo, Joseph Romen ; Katti, Guruprasad
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
This paper describes the electrical characteristics of the fine pitch interconnects in silicon carrier systems. The characteristics of such interconnects are explored and a typical FPGA-memory system is compared viz-a-viz with a traditional PCB system from low data rates to higher data rates. Our case-study shows that even though highly resistive wires are used in silicon carrier the interconnects are SI robust due to the shorter die to die interconnect length and the absence of package parasitics.
Keywords :
field programmable gate arrays; integrated circuit interconnections; integrated circuit packaging; integrated logic circuits; three-dimensional integrated circuits; FPGA memory system; die to die interconnect; fine pitch interconnects; package parasitic; signal integrity robustness; silicon carrier system; through-silicon interposer interconnects; Bandwidth; Capacitance; Integrated circuit interconnections; Robustness; Silicon; Timing; Wires;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507115
