• DocumentCode
    2034497
  • Title

    Interconnect series impedance determination using a surface ribbon method

  • Author

    Tuncer, Emre ; Lee, Beom-Taek ; Neikirk, Dean P.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
  • fYear
    1994
  • fDate
    2-4 Nov 1994
  • Firstpage
    249
  • Lastpage
    252
  • Abstract
    In this paper we apply the current filament method to surface “ribbons” instead of volume filaments, leading to a substantial reduction in problem size and increase in computational efficiency. The accuracy is excellent when compared to “full Weeks” calculations, with a factor of almost 100 reduction in CPU time
  • Keywords
    multichip modules; CPU time; MCMs; computational efficiency; current filament method; interconnect series impedance determination; problem size; surface ribbon method; Computational efficiency; Conductors; Conformal mapping; Current density; Current distribution; Frequency; Magnetic fields; Slabs; Surface fitting; Surface impedance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-2411-0
  • Type

    conf

  • DOI
    10.1109/EPEP.1994.594163
  • Filename
    594163
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2034497