A 3D micro-channel cooling system embedded in LTCC packaging substrate

Micro fluidic channel embedded in LTCC packaging substrate is reported in IEEE-NEMS 2010 by our team, which showed that the micro channel can promise a great effect on heat-dissipating of the heat resource packaged in the LTCC substrate. Yet we find there is more room to intensify this effect. So we design a 3-D micro channel embedded in LTCC substrate which is not fabricated in one single layer but fabricated through multilayer substrate and constitute a channel circle surrounding the heat resource packaged inside. We accomplished some simulation on heat distribution, flow pressure and flow velocity field with commercial software FLUENT. This new structure can promise a much better effect on heat redistribution compared to single layer micro channel embedded in LTCC substrate. With this fluid channel the temperature of the outside package is tremendously cut down.