• DocumentCode
    2034550
  • Title

    Discharge inception on printed circuit board in an artificial fog

  • Author

    Du, B.X. ; Liu, Yong ; Yu Gao

  • Author_Institution
    Coll. of Electr. Eng. & Autom., Tianjin Univ., China
  • fYear
    2004
  • fDate
    17-20 Oct. 2004
  • Firstpage
    555
  • Lastpage
    558
  • Abstract
    The process leading to surface discharge inception on a printed circuit board (PCB) in artificial fog was investigated, with particular attention to the discharge inception time. We employed a fog environment formed by an ultrasonic vibration saline fog generator at room temperature, and the conductance was set at 2.0 mS/cm, 2.5 mS/cm and then up to 5.0 mS/cm. The experiment was carried out under dc power. An epoxy resin laminate PCB was employed to investigate the effects of test voltage and saline fog conductance on the surface discharge inception. The relation between the inception time of the discharge and the test voltage was examined. The inception voltage and the capacitance of the PCB were measured. The study revealed that the discharge inception time decreases with increasing test voltage and conductance. The inception voltage decreases with increasing the conductance. The inception time and capacitance increase with increasing exposure time.
  • Keywords
    electric admittance; epoxy insulation; fog; laminates; printed circuits; surface discharges; 2.0 mS/cm; 2.5 mS/cm; 5.0 mS/cm; PCB capacitance; PCB surface discharge; artificial saline fog; discharge inception time; epoxy resin laminate PCB; fog conductance; inception voltage; surface discharge inception; test voltage/inception time relation; ultrasonic vibration saline fog generator; Capacitance; Circuit testing; Electrodes; Epoxy resins; Laminates; Printed circuits; Surface discharges; Surface morphology; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
  • Print_ISBN
    0-7803-8584-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2004.1364310
  • Filename
    1364310