• DocumentCode
    2034657
  • Title

    Surface-modified diamond embedded in nickel matrix composite for intrinsic polishing application

  • Author

    Shih, Ching-Jui ; Lin, Wei-Chih ; Lin, Chao-Sung ; Pan, Yung-Ning

  • Author_Institution
    Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2012
  • fDate
    5-8 March 2012
  • Firstpage
    681
  • Lastpage
    684
  • Abstract
    An approach for fabricating a diamond conditioner by using a micro patterning and nickel electroforming method is demonstrated to improve the material removal rate (MRR) and the diamond worn ratio. By compared with the currently commercial conditioner, our developed diamond conditioner performs approximate 35% of the MRR and 18% of diamond worn ratio. The contact surface between the diamond and the counterpart is increased by the well-controlled of the grit protrusion which is within the range of 1.36 micrometer. This protrusion control not only results in the MRR and frictional coefficient increase, but also the load force reduction on each diamond grit during a wearing test. Furthermore, a chemical treatment is utilized to functionalize the surface of the diamond grits for the adhesion enhancement which can eliminate the matrix defects at the interface between the grits and nickel matrix.
  • Keywords
    adhesion; chemical mechanical polishing; composite materials; diamond; electroforming; friction; nickel; wear resistance; wear testing; C-Ni; adhesion; chemical mechanical polishing; chemical treatment; contact surface; diamond conditioner; diamond embedded nickel matrix composite; frictional coefficient; material removal rate; matrix defects; micropatterning; nickel electrofonning; reduction; surface treatment; wear resistance; wear testing; Diamond-like carbon; Slurries; Temperature measurement; Time measurement; Micro-patterning; diamond conditioner; electroforming;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4673-1122-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2012.6196867
  • Filename
    6196867