A study of electrical performance for next generation plastic packages

Author

Stys, D. ; Bhattacharyya, B.K.

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

278

Lastpage

282

Abstract

The authors compare the power and ground path inductance for three types of plastic packages. These packages are the 196 S/L PQFP (single-layer plastic quad flat pack), the 296 FR-PQFP (fine-pitch PQFP), and the 196 MM-PQFP (multilayer molded PQFP with one power and one ground plane). The S/L PQFP and the MM-PQFP packages are wirebonded and the FP-PQFP package is TAB (tape automated bonding) bonded. The authors also present plots of lead inductance as a function of the number of leads for the three packages and MM-PQFP plane inductance as a function of the number of leads. Simulations show that the MM-PQFP has the lowest power and ground path inductance while the S/L PQFP has the highest

Keywords

inductance measurement; packaging; tape automated bonding; TAB; electrical performance; fine-pitch PQFP; ground path inductance; lead inductance; multilayer molded PQFP; plastic packages; power; single-layer plastic quad flat pack; wirebonded; Bonding; Frequency; Geometry; Inductance; Microassembly; Nonhomogeneous media; Plastic packaging; Proximity effect; Switches; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163890

Filename

163890