• DocumentCode
    2034729
  • Title

    Multiaxial mechanical behavior of 63Sn-37Pb solder

  • Author

    Low, S.R., III ; Fields, R.J. ; Lucey, G.K., Jr.

  • Author_Institution
    Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    292
  • Lastpage
    298
  • Abstract
    Predicting solderability and the mechanical performance of complex solder joints requires constitutive equations that relate multiaxial stressing to the mechanical response of the solder. To address this need, the authors have investigated the effects of uniaxial tension and pure shear on the elastic, plastic, and fracture behavior of 63Sn-37Pb solder. Using standard tensile specimens, stress-strain curves were recorded at effective engineering strain rates between 0.0002 and 0.2 s -1. From these curves, young´s modulus, 0.2% offset yield strength, ultimate tensile strength, and elongation to fracture were determined. Using similar torsion specimens, tests to examine shear behavior were conducted. From these tests, shear modulus, shear yield strength, and ultimate shear strength were determined for effective strain rates between approximately 0.0001 and 0.02 s-1. little or no effect of strain rate on Young´s modulus or shear modulus was observed. The plastic properties (yield and ultimate strengths) in both tension and shear are strongly rate dependent and agree with the von Mises multiaxial yield theory. Fracture behavior (e.g. ductility) is strongly rate dependent
  • Keywords
    Young´s modulus; ductility; elastic deformation; fracture mechanics; lead alloys; plastic deformation; shear modulus; shear strength; soldering; stress-strain relations; tin alloys; torsion; yield strength; 63Sn-37Pb solder; Sn-Pb solder; complex solder joints; ductility; elastic properties; fracture behavior; mechanical response; multiaxial stressing; plastic properties; shear behavior; shear modulus; shear yield strength; solderability; stress-strain curves; tensile specimens; torsion specimens; ultimate tensile strength; uniaxial tension; yield strength; young´s modulus; Aging; Bars; Capacitive sensors; Materials testing; Microstructure; NIST; Plastics; Soldering; Stress; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163892
  • Filename
    163892