Title :
A network based approach to the hybrid electromagnetic/circuit modeling of the power grid of multifunctional planar integrated circuits
Author :
Rong, Aosheng ; Cangellaris, Andreas C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois, Urbana, IL, USA
Abstract :
A methodology is presented for the development of a numerical model for the power distribution network of the multi-functional, hybrid planar, integrated circuits. The discrete model of the structure of interest is developed in terms of two-dimensional finite element models for the domains between the closely spaced, adjacent power/ground planes and frequency-dependent multi-port network descriptions of the various three-dimensional features (e.g., pins, vias, metallization voids, and plan edges). Passive rational function fits of these network matrices allow for the development of a state-space model for the entire structure. A specific type of a network macromodel used for vias is described. Also included is a rational function model for the skin effect impedance of the metallization. A novel alternating direction implicit time-domain update scheme is used for the unconditionally stable integration of the state-space model under arbitrary current switching waveforms exciting the power distribution network.
Keywords :
electric impedance; finite element analysis; integrated circuit metallisation; integrated circuit modelling; integration; matrix algebra; power supplies to apparatus; skin effect; state-space methods; time-domain analysis; waveform analysis; 2D finite element model; adjacent power-ground planes; alternating direction implicit time-domain update scheme; arbitrary current switching waveforms; frequency-dependent multiport network descriptions; hybrid electromagnetic-circuit modeling; metallization voids; multifunctional planar integrated circuits; network macromodel; network matrix; numerical integration; passive rational function fits; pins; plan edges; power distribution network; power grid; rational function model; skin effect impedance; state-space model; vias; Electromagnetic modeling; Finite element methods; Frequency; Hybrid integrated circuits; Integrated circuit modeling; Metallization; Numerical models; Pins; Power grids; Power systems;
Conference_Titel :
Electromagnetics in Advanced Applications, 2009. ICEAA '09. International Conference on
Conference_Location :
Torino
Print_ISBN :
978-1-4244-3385-8
Electronic_ISBN :
978-1-4244-3386-5
DOI :
10.1109/ICEAA.2009.5297307