Title :
Wafer positioning by laser scanning method
Author :
Lee, Ju-Yi ; Chen, Yi-Cheng ; Chen, Jian-You ; Lee, Yun-Yan ; Chen, Yu-Bin
Author_Institution :
Dept. of Mech. Eng., Nat. Central Univ., Chungli, Taiwan
Abstract :
A laser scanning method for wafer positioning is proposed. This wafer positioning method incorporates a laser scanner system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The position of wafer relative to the robot plate is determined by signal processing of the time-sequence signal. The measurement precision is about 0.3 mm.
Keywords :
optical scanners; position control; production engineering computing; robotic assembly; semiconductor device manufacture; signal processing; laser scanning method; robot plate; scattering light receiving system; signal processing; time sequence signal detection; wafer positioning; Laser beams; Measurement by laser beam; Position measurement; Robot kinematics; Robot sensing systems; Uncertainty; Laser scanning; Wafer positioning;
Conference_Titel :
SICE Annual Conference (SICE), 2011 Proceedings of
Conference_Location :
Tokyo
Print_ISBN :
978-1-4577-0714-8
