• DocumentCode
    2034783
  • Title

    Submerged liquid jet array impingement cooling with high gravity effects

  • Author

    Wang, Z.Y. ; Wong, T.N. ; Duan, Fang ; Toh, K.C. ; Choo, Kok Fah ; Tan, S.P. ; Loh, C.V. ; Leong, Y.W.

  • Author_Institution
    Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2012
  • fDate
    5-7 Dec. 2012
  • Firstpage
    511
  • Lastpage
    514
  • Abstract
    Submerged liquid jet array impingement has been considered as one of the most effective cooling technologies. By combining the impingement and forced convection effects, it provides high heat transfer coefficients and compact cooling designs. The present studies are to extend the liquid jet array impingement for the thermal management of airborne electronic devices, which are subjected to conditions with high gravities. The high gravity studies were conducted on an Submerged liquid jet array cooling system, which had a nozzle plate with 14×21 circular nozzles arranged in a uniform square pattern with a jet-to-jet distance of 7.0 mm. The diameter of the nozzles was 0.3 mm and the jet-to-target spacing was 3.0 mm. The high gravity test results showed that an heat transfer coefficient of about 7000 W/(m2.K) could be achieved at a flow rate of 4.5 L/min for a heated plate up 12g in all directions. The computational fluid dynamics (CFD) numerical simulations of the jet array impingement were conducted. The heat transfer coefficient results agree well with the experimental data and some information of the temperature and velocity fields was obtained.
  • Keywords
    computational fluid dynamics; cooling; forced convection; jets; nozzles; numerical analysis; thermal management (packaging); CFD numerical simulation; airborne electronic device; circular nozzle; compact cooling design; computational fluid dynamics; cooling technology; distance 7 mm; flow rate; forced convection effect; gravity effect; gravity test; heat transfer coefficient; jet-to-jet distance; jet-to-target spacing; nozzle plate; submerged liquid jet array cooling system; submerged liquid jet array impingement cooling; temperature field; thermal management; velocity field; Conferences; Electronic packaging thermal management; Electronics packaging; Heat engines; Heat transfer; Thermal engineering; Zirconium; Submerged liquid impingement cooling; high gravity; jet array;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4553-8
  • Electronic_ISBN
    978-1-4673-4551-4
  • Type

    conf

  • DOI
    10.1109/EPTC.2012.6507135
  • Filename
    6507135