DocumentCode :
2034790
Title :
Thermal analysis for series LC integrated passive resonant module based on finite-element modeling
Author :
Lee, Seung-Yo ; Zhao, Lingyin ; Strydom, Johan T. ; Odendaal, W.G. ; van Wyk, J.D.
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
2
fYear :
2002
fDate :
2002
Firstpage :
1009
Abstract :
In recent years, the passive integrated power electronic module (IPEM), which has been implemented as resonant tank in resonant DC-DC converters, has gained research interest because of its merits for possibly reducing the total volume of the resonant converter system. In this paper, thermal analysis for a series resonant LC passive IPEM is performed. Especially, a 3-dimensional thermal model based on finite-element modeling (FEM) using I-DEAS is presented and the thermal distribution of the integrated passive module is simulated. In order to verify the thermal analysis results, an experimental prototype LC passive REM was constructed and temperature distribution measured using an IR (Infrared) camera and thermocouples and compared to simulation results. A good correlation between the 3-D thermal model and thermal test results was achieved. Moreover, 1-dimensional thermal analysis was also performed and presented to compare results of the hot spot temperatures in the interior of the passive IPEM using the 1-D and the 3-D models.
Keywords :
DC-DC power convertors; finite element analysis; passive networks; resonant power convertors; temperature distribution; temperature measurement; thermal analysis; 3-D thermal model; finite-element modeling; hot spot temperatures; integrated power electronic module; resonant DC-DC converters; resonant tank; series LC integrated passive resonant module; temperature distribution; thermal analysis; thermal distribution; thermal test results; Cameras; DC-DC power converters; Finite element methods; Performance analysis; Power electronics; Power system modeling; Resonance; Temperature distribution; Temperature measurement; Virtual prototyping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialists Conference, 2002. pesc 02. 2002 IEEE 33rd Annual
Print_ISBN :
0-7803-7262-X
Type :
conf
DOI :
10.1109/PSEC.2002.1022587
Filename :
1022587
Link To Document :
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