Title :
Investigation of flow boiling instabilities in silicon microgap heat sink
Author :
Alam, Tauhidul ; Poh Seng Lee ; Yap, C.R.
Author_Institution :
Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore, Singapore
Abstract :
Flow boiling instabilities induce mechanical vibration in the system and deteriorate the heat transfer performances, for example- premature dryout, critical heat flux limitation etc. The two phase microgap heat sink has novel potential to mitigate these undesirable flow boiling instabilities and flow reversal issues inherent with two phase microchannel heat sink. This work is an experimental study of boiling instabilities in microgap heat sink for different microgap depths ranging from 80μm-1000μm, mass fluxes from 390kg/m2s-900kg/m2s, heat fluxes up to 85W/cm2 and different microgap surface roughnesses, Ra=0.6-1μm. A series of systematic experiments have been carried out to investigate the inlet pressure and wall temperature oscillations during two phase flow boiling condition under uniform heating, with deionized water as a cooling liquid. Experimental result shows that pressure oscillation increases with the decreasing microgap depth. Temperature oscillation is observed lower for smaller gap than larger gap up to a certain heat flux condition before the dryout phase. In addition, inlet pressure instabilities increase with increasing heat flux and decreasing mass flux. Moreover, surface roughness has an adverse effect on the inlet pressure instability at larger depth microgap heat sink and inlet pressure fluctuation increases with increasing surface roughness.
Keywords :
cooling; heat sinks; surface roughness; vibrations; cooling liquid; critical heat flux limitation; deionized water; dryout phase; flow boiling instability; flow reversal; heat flux condition; heat transfer; inlet pressure fluctuation; inlet pressure instability; mass flux; mechanical vibration; microchannel heat sink; microgap surface roughness; premature dryout; silicon microgap heat sink; temperature oscillation; Fluctuations; Heat sinks; Heating; Rough surfaces; Silicon; Surface roughness; Temperature measurement;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507137