Study of thin film adhesion properties of multilayer flexible electronics composites

Author

Li, C.C. ; Liu, Z.H. ; Pan, C.T. ; Tseng, J.K. ; Huang, H.L. ; Mao, S.W. ; Shen, S.C. ; Chang, S.J.

Author_Institution

Dept. of Mech. & Electro-Mech. Eng., Nat. Sun Yat-Sun Univ., Kaohsiung, Taiwan

fYear

2012

fDate

5-8 March 2012

Firstpage

725

Lastpage

728

Abstract

The deformation between interface and adhesion mechanism of multi-layer flexible electronics composite were discussed. First, ITO (Indium tin oxide), Al (Aluminum) and ZnO (Zinc oxide) were directly deposited on a PET (Polyethylene terephthalate) substrate by RF (Radiofrequency) magnetron sputtering in room temperature to form the flexible multi-layer structures (ZnO/ITO/PET and ZnO/Al/PET) for piezoelectric transducers. ZnO thin film reveals a high (002) c-axis preferred orientation at 2θ=34.45° with an excellent piezoelectric property. To analyze adhesion following a periodic mechanical stress by vibrating flexible composite plates, nano-scratching test (Nanoindenter XP system) was used for scratch process to learn the relationship between normal force and penetration depth. The results show that the plastic deformation can be observed from SEM and OM observation between Al film and PET substrate. This behavior means that the deposited ZnO film has excellent adhesion with Al/PET conductive substrate compared with ITO/PET. Through nano-indentation test, ZnO film deposited on Al/PET substrate decreased the elastic modulus and hardness compared with ITO/PET substrate.

Keywords

II-VI semiconductors; adhesion; aluminium; elastic moduli; flexible electronics; hardness; multilayers; nanoindentation; piezoelectric thin films; piezoelectric transducers; plastic deformation; scanning electron microscopy; sputtering; thin film circuits; zinc compounds; ITO/PET substrate; OM observation; SEM; ZnO-Al; ZnO-ITO; conductive substrate; elastic modulus; flexible composite plate vibration; flexible multilayer structure; hardness; interface-adhesion mechanism deformation; multilayer flexible electronics composite; nanoindentation test; nanoindenter XP system; nanoscratching test; normal force; penetration depth; periodic mechanical stress; piezoelectric property; piezoelectric transducer; plastic deformation; polyethylene terephthalate substrate; radiofrequency magnetron sputtering; scratch process; temperature 293 K to 298 K; thin film adhesion properties; Argon; Artificial intelligence; Films; Indium tin oxide; Positron emission tomography; Radio frequency; Zinc oxide; Adhesion; Al; Flexible electronics composite; ITO; Nano-scratching; PET; ZnO;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on

Conference_Location

Kyoto

Print_ISBN

978-1-4673-1122-9

Type

conf

DOI

10.1109/NEMS.2012.6196877

Filename

6196877