3D-MID technology MEMS connectivity at system level

After being established as a leading technology for the manufacturing of 3D antennas for mobile phones the 3D-MID technology (three dimensional molded interconnect devices) is gaining a strong foothold in other applications like MEMS packaging, sensors, LEDs, switches and connectors and it seems to become a game changing technology thanks to its capabilities: Miniaturization, rationalization and functional integration. 3D-MID allows miniaturization by the integration of mechanical and electronic functions in one part and so much more compact construction and much greater function density can be achieved.