DocumentCode
2035426
Title
Automated module fabrication
Author
Bergstrom, Nils
Author_Institution
Lockheed Sanders Avionics, Nashua, NH, USA
fYear
1994
fDate
10-12 May 1994
Firstpage
863
Lastpage
875
Abstract
The Automated Module Fabrication (AMF) line was developed to improve quality and reduce the cost of custom microwave modules, analog and digital hybrids and MCM´s. The approach stresses flexibility and the ability to run small or large lot sizes with the efficiency normally only associated with mass production. Processes included are computer automated die inspection and sort, epoxy and solder die attach, a robotic wire bonding workcell, automated carrier probing and related process monitors such as X-ray void detection and wire pull. A custom computer integrated manufacturing system was developed to interface with the equipment and provide paperless documentation. This report details the work performed, problem areas encountered, and some unique solutions
Keywords
computer integrated manufacturing; integrated circuit technology; automated carrier probing; automated module fabrication; computer automated die inspection; computer integrated manufacturing system; custom microwave modules; robotic wire bonding; Bonding; Computer displays; Costs; Fabrication; Inspection; Mass production; Microassembly; Occupational stress; Robotics and automation; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro/94 International. Conference Proceedings. Combined Volumes.
Conference_Location
Boston, MA
Print_ISBN
0-7803-2630-X
Type
conf
DOI
10.1109/ELECTR.1994.472636
Filename
472636
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