DocumentCode :
2035426
Title :
Automated module fabrication
Author :
Bergstrom, Nils
Author_Institution :
Lockheed Sanders Avionics, Nashua, NH, USA
fYear :
1994
fDate :
10-12 May 1994
Firstpage :
863
Lastpage :
875
Abstract :
The Automated Module Fabrication (AMF) line was developed to improve quality and reduce the cost of custom microwave modules, analog and digital hybrids and MCM´s. The approach stresses flexibility and the ability to run small or large lot sizes with the efficiency normally only associated with mass production. Processes included are computer automated die inspection and sort, epoxy and solder die attach, a robotic wire bonding workcell, automated carrier probing and related process monitors such as X-ray void detection and wire pull. A custom computer integrated manufacturing system was developed to interface with the equipment and provide paperless documentation. This report details the work performed, problem areas encountered, and some unique solutions
Keywords :
computer integrated manufacturing; integrated circuit technology; automated carrier probing; automated module fabrication; computer automated die inspection; computer integrated manufacturing system; custom microwave modules; robotic wire bonding; Bonding; Computer displays; Costs; Fabrication; Inspection; Mass production; Microassembly; Occupational stress; Robotics and automation; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electro/94 International. Conference Proceedings. Combined Volumes.
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-2630-X
Type :
conf
DOI :
10.1109/ELECTR.1994.472636
Filename :
472636
Link To Document :
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