• DocumentCode
    2035426
  • Title

    Automated module fabrication

  • Author

    Bergstrom, Nils

  • Author_Institution
    Lockheed Sanders Avionics, Nashua, NH, USA
  • fYear
    1994
  • fDate
    10-12 May 1994
  • Firstpage
    863
  • Lastpage
    875
  • Abstract
    The Automated Module Fabrication (AMF) line was developed to improve quality and reduce the cost of custom microwave modules, analog and digital hybrids and MCM´s. The approach stresses flexibility and the ability to run small or large lot sizes with the efficiency normally only associated with mass production. Processes included are computer automated die inspection and sort, epoxy and solder die attach, a robotic wire bonding workcell, automated carrier probing and related process monitors such as X-ray void detection and wire pull. A custom computer integrated manufacturing system was developed to interface with the equipment and provide paperless documentation. This report details the work performed, problem areas encountered, and some unique solutions
  • Keywords
    computer integrated manufacturing; integrated circuit technology; automated carrier probing; automated module fabrication; computer automated die inspection; computer integrated manufacturing system; custom microwave modules; robotic wire bonding; Bonding; Computer displays; Costs; Fabrication; Inspection; Mass production; Microassembly; Occupational stress; Robotics and automation; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electro/94 International. Conference Proceedings. Combined Volumes.
  • Conference_Location
    Boston, MA
  • Print_ISBN
    0-7803-2630-X
  • Type

    conf

  • DOI
    10.1109/ELECTR.1994.472636
  • Filename
    472636