Title :
Glass microwave IC packaging technology
Author_Institution :
M/A-COM Inc., Burlington, MA, USA
Abstract :
A high performance integration technology for microwave circuits based on a novel glass-silicon wafer is described. Active circuits can be created by using the silicon base substrate for diodes or a completely passive approach can be used as an integration medium for multi-chip assemblies. The substrate performance characteristics and processing are covered along with examples of circuits for both military and commercial applications. The technology is shown to be a cost effective means of integrating discrete semiconductors or ICs into higher level functions
Keywords :
borosilicate glasses; hybrid integrated circuits; integrated circuit packaging; microwave integrated circuits; multichip modules; silicon; substrates; thin film circuits; B2O3-SiO2; B2O3-SiO2-Si; BSG; BSG-Si; Si; glass microwave IC packaging technology; glass-Si wafer; high performance integration technology; multichip assemblies; substrate performance characteristics; substrate processing; Active circuits; Assembly; Cost function; Glass; Integrated circuit packaging; Microwave circuits; Microwave technology; Semiconductor diodes; Silicon; Substrates;
Conference_Titel :
Electro/94 International. Conference Proceedings. Combined Volumes.
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-2630-X
DOI :
10.1109/ELECTR.1994.472637
