CVD diamond electronic packaging applications

Author

Lu, Grant

Author_Institution

Norton Diamond Film, Northboro, MA, USA

fYear

1994

fDate

10-12 May 1994

Firstpage

836

Lastpage

839

Abstract

As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. One such material that has excellent thermal conductivity is CVD diamond. Designers have already used CVD diamond successfully in the production of heat sinks for laser diodes and laser diode arrays, and in the design of microwave substrates. As the cost of CVD diamond decreases, designers also are beginning to incorporate CVD diamond into their designs for single-chip packages and multichip modules

Keywords

CVD coatings; MMIC; diamond; integrated circuit packaging; modules; multichip modules; substrates; thermal conductivity; C; CVD diamond; MCM; MMIC substrate; electronic packaging applications; microwave substrates; multichip modules; power device modules; single-chip packages; thermal conductivity; thermal management materials; Conducting materials; Diode lasers; Electronic packaging thermal management; Electronics packaging; Optical design; Optical materials; Production; Thermal conductivity; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electro/94 International. Conference Proceedings. Combined Volumes.

Conference_Location

Boston, MA

Print_ISBN

0-7803-2630-X

Type

conf

DOI

10.1109/ELECTR.1994.472640

Filename

472640