DocumentCode :
2035522
Title :
CVD diamond electronic packaging applications
Author :
Lu, Grant
Author_Institution :
Norton Diamond Film, Northboro, MA, USA
fYear :
1994
fDate :
10-12 May 1994
Firstpage :
836
Lastpage :
839
Abstract :
As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. One such material that has excellent thermal conductivity is CVD diamond. Designers have already used CVD diamond successfully in the production of heat sinks for laser diodes and laser diode arrays, and in the design of microwave substrates. As the cost of CVD diamond decreases, designers also are beginning to incorporate CVD diamond into their designs for single-chip packages and multichip modules
Keywords :
CVD coatings; MMIC; diamond; integrated circuit packaging; modules; multichip modules; substrates; thermal conductivity; C; CVD diamond; MCM; MMIC substrate; electronic packaging applications; microwave substrates; multichip modules; power device modules; single-chip packages; thermal conductivity; thermal management materials; Conducting materials; Diode lasers; Electronic packaging thermal management; Electronics packaging; Optical design; Optical materials; Production; Thermal conductivity; Thermal management; Thermal management of electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electro/94 International. Conference Proceedings. Combined Volumes.
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-2630-X
Type :
conf
DOI :
10.1109/ELECTR.1994.472640
Filename :
472640
Link To Document :
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