DocumentCode :
2035577
Title :
A concurrent object oriented model for fine to medium grain parallelism as a basis for parallel object oriented architectures
Author :
Balou, A.T. ; Kontoghiorghes, E.J. ; Tzortzi, E.A.
Author_Institution :
Dept. of Comput. Sci., Univ. Coll. London, UK
Volume :
1
fYear :
1993
fDate :
19-21 Oct. 1993
Firstpage :
106
Abstract :
This paper presents a concurrent model for fine to medium grain object based parallelism which can be taken as a basis for the design of parallel architectures. Our proposal is motivated by the observation that conventional architectures are inadequate to efficiently support object based parallelism, especially fine to medium grain. Our model combines the fundamental object oriented techniques (encapsulation, inheritance, polymorphism, uniform message metaphor) with a variety of concurrency features in a consistent manner. Regarding concurrency, objects are active entities i.e capable of handling communication with other objects and synchronising incoming requests. The model is based on the message driven approach and expresses a tradeoff between the necessary flexibility for mapping diverse patterns of object interaction, and simplicity for feasible hardware implementations.<>
Keywords :
data structures; database management systems; inheritance; object-oriented programming; parallel architectures; parallel programming; active entities; concurrent object oriented model; encapsulation; fine to medium grain parallelism; inheritance; message driven approach; object based parallelism; parallel object oriented architectures; polymorphism; uniform message metaphor; Computational modeling; Computer architecture; Computer science; Concurrent computing; Educational institutions; Encapsulation; Hardware; Object oriented modeling; Parallel architectures; Parallel processing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON '93. Proceedings. Computer, Communication, Control and Power Engineering.1993 IEEE Region 10 Conference on
Conference_Location :
Beijing, China
Print_ISBN :
0-7803-1233-3
Type :
conf
DOI :
10.1109/TENCON.1993.319939
Filename :
319939
Link To Document :
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