DocumentCode
2035597
Title
Eliminating CFC usage for multichip module cleaning: a users experience in choosing an alternate solution
Author
Johnson, Dean P.
Author_Institution
Tandem Comput. Inc., Cupertino, CA, USA
fYear
1991
fDate
11-16 May 1991
Firstpage
400
Lastpage
403
Abstract
Tandem´s VLSI technology development laboratory shut down its CFC (chlorofluorocarbon) degreaser in December 1990. The author discusses the materials and equipment issues that were considered in developing a non-CFC cleaning process for multichip modules. Tandem´s solution is discussed in connection with the choice of a semi-aqueous solvent, the batch-type immersion equipment that was chosen, and environmental concerns
Keywords
hybrid integrated circuits; integrated circuit manufacture; modules; packaging; surface treatment; CFC usage elimination; Tandem; batch-type immersion equipment; chlorofluorocarbon; environmental concerns; multichip module cleaning; nonCFC cleaning process; semiaqueous solvent; Bonding; Cleaning; Computer aided manufacturing; Contamination; Material storage; Multichip modules; Packaging machines; Silicon; Solvents; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-0012-2
Type
conf
DOI
10.1109/ECTC.1991.163906
Filename
163906
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