Title :
Interfacing IEEE 1149.5 to IEEE 1149.1
Author :
Young, Greg ; McHugh, Pat
Author_Institution :
Texas Instrum. Inc., USA
Abstract :
As today´s electronics systems increase in complexity, techniques allowing access to “low level” test resources (built-in self-test, boundary scan) are crucial for developing high fault coverage tests. Two IEEE test bus protocol standards have been defined to provide this access at the module (IEEE 1149.5) and device levels (IEEE 1149.1), respectively. This paper discusses the IEEE 1149.5 standard´s proposed method for interfacing to the IEEE 1149.1 boundary scan and the issues associated with this interfacing
Keywords :
IEEE standards; boundary scan testing; built-in self test; protocols; IEEE 1149.1; IEEE 1149.5; IEEE test bus protocol standards; boundary scan; boundary scan testing; built-in self-test; Access protocols; Automatic testing; Backplanes; Built-in self-test; Controllability; Electronic equipment testing; Instruments; Master-slave; Observability; System testing;
Conference_Titel :
Electro/94 International. Conference Proceedings. Combined Volumes.
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-2630-X
DOI :
10.1109/ELECTR.1994.472647
