Title :
Implantable blood flow sensor integrated on flexible circuit for vascular graft application
Author :
Li Shiah Lim ; Jia Hao Cheong ; Jerry, J.L.A. ; He, Chu
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
This paper reports an implantable blood flow sensor system integrated on flexible circuit that consists of pressure sensor and inductively powered wireless sensor interface Application Specific Integrated Circuit (ASIC) for early graft failure detection application. The proposed system was embedded within the vascular graft to have continuously monitoring the differential blood pressure change as an indication of stenosis build- up in the graft. The fabricated pressure sensor is showed the step of 0.5psi of pressure changes is clearly visible with the resistance change. The resolution of pressure change 8mmHg was achieved. [1] The whole system was successfully integrated on designed flexible circuit by optimizing method of flip-chip bonding with gold stud bump and underfill encapsulant at lower temperature. The assembled system was successfully demonstrated wirelessly.
Keywords :
application specific integrated circuits; biomedical electronics; biosensors; flip-chip devices; flow sensors; pressure sensors; prosthetics; ASIC; application specific integrated circuit; blood pressure; flexible circuit; flip-chip bonding; gold stud bump; graft failure detection; implantable blood flow sensor; inductively powered wireless sensor interface; pressure sensor; underfill encapsulant; vascular graft; Application specific integrated circuits; Blood flow; Bonding; Flip-chip devices; Force; Gold; Temperature sensors;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507171