Title :
Effective 90° interconnections using laser solder jetting technologies for optical coherence tomography applications
Author :
Sun, Wen ; Sun, Tairen ; Lim, Khan ; Ding, Maosheng ; Ruiqi Lim ; Johari, B. ; Dinish, U.S. ; Olivo, M.
Author_Institution :
Miniaturized Med. Devices (MMD) Group, A*Star, Singapore, Singapore
Abstract :
We report a simple yet effective approach to interconnect pairs of orthogonally aligned out-of-plane bond-pads that are separated at wide gaps of about 100 μm. The developed method can effectively bridge interconnections between a MEMS micromirror device chip (width × height × thickness: 1.9 × 2.2 × 0.5 mm3) on a mini PCB bench (width × length × thickness: 1.6 × 12 × 0.4 mm3) with just a few standard procedural steps. The measured average interconnection resistance is about 0.6 Ω. The packaged system is currently target for optical coherence tomography (OCT) applications and the concept can be applied to many other miniaturized medical device packaging situations that require orthogonally aligned out-of-plane interconnections.
Keywords :
laser materials processing; micro-optomechanical devices; microfabrication; micromirrors; optical tomography; packaging; printed circuit interconnections; printed circuit manufacture; soldering; MEMS micromirror device chip; interconnections; laser solder jetting technology; miniPCB bench; miniaturized medical device packaging; optical coherence tomography applications; orthogonal alignment; out-of-plane bond p; size 0.4 mm; size 0.5 mm; size 1.6 mm; size 1.9 mm; size 12 mm; size 2.2 mm; Biomedical optical imaging; Lasers; Micromechanical devices; Micromirrors; Optical imaging; Optical interconnections; Packaging;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507175
