Comparisons of the electrical and mechanical reliabilities between Sn-3.5Ag and Sn-0.7Cu Pb-free solder bumps

Author

Sung-Hyuk Kim ; Jong-Jin Park ; Jae-Myeong Kim ; Sehoon Yoo ; Young-Bae Park

Author_Institution

Sch. of Mater. Sci. & Eng., Andong Nat. Univ., Andong, South Korea

fYear

2012

fDate

5-7 Dec. 2012

Firstpage

719

Lastpage

722

Abstract

The effects of surface finishes on the in situ interfacial reaction characteristics on both ball grid array (BGA) typed Sn-3.5Ag and Sn-0.7Cu lead-free solder bumps were investigated under annealing and electromigration (EM) test conditions of 135 °C to 170°C with 5.0 × 10³ A/cm². The failure mechanisms were explored in detail via in-situ EM tests. For the shear test, the shear force of both Sn-3.5Ag and Sn-0.7Cu solder joints increased and the shear energy decreased with increasing shear speed for the high speed of 1000 mm/s.

Keywords

annealing; ball grid arrays; copper alloys; electromigration; failure analysis; reliability; silver alloys; solders; tin alloys; BGA; EM test conditions; Sn-Ag; Sn-Cu; annealing; ball grid array; electrical reliabilities; electromigration test conditions; failure mechanisms; in-situ EM tests; lead-free solder bumps; mechanical reliabilities; shear force; solder joints; temperature 135 degC to 170 degC; Annealing; Force; Lead; Soldering; Surface cracks; Surface finishing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th

Conference_Location

Singapore

Print_ISBN

978-1-4673-4553-8

Electronic_ISBN

978-1-4673-4551-4

Type

conf

DOI

10.1109/EPTC.2012.6507176

Filename

6507176