• DocumentCode
    2036110
  • Title

    Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

  • Author

    Duan, Xiaomin ; Dahl, David ; Schuster, Christian ; Ndip, Ivan ; Lang, Klaus-Dieter

  • Author_Institution
    Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
  • fYear
    2015
  • fDate
    10-13 May 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.
  • Keywords
    Harmonic analysis; Integrated circuit modeling; Metals; Permittivity; Silicon; Substrates; Through-silicon vias; cylindrical wave function; multipole expansion method; through-silicon-via;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2015 IEEE 19th Workshop on
  • Conference_Location
    Berlin, Germany
  • Type

    conf

  • DOI
    10.1109/SaPIW.2015.7237387
  • Filename
    7237387
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2036110