Title :
Scalable power delivery design methodology for SoC on cost driven platforms
Author :
Cai, Kinger Xingjian ; Ji, Steven Yun
Author_Institution :
Intel Corporation, Santa Clara, CA, United States
Abstract :
A scalable power delivery analysis methodology is described for SoCs targeted at cost-driven platforms. The methodology is applied at different design stages to consolidate a hundred independent power supplies at bump level to half that at solder ball level and to five major power supplies at board level.
Keywords :
Couplings; Noise; Power supplies; Rails; Regulators; Routing; System-on-chip; cost driven SoC platform; power rails consolidation and isolation; scalable power delivery Design; small form factor;
Conference_Titel :
Signal and Power Integrity (SPI), 2015 IEEE 19th Workshop on
Conference_Location :
Berlin, Germany
DOI :
10.1109/SaPIW.2015.7237389
