• DocumentCode
    2036152
  • Title

    Scalable power delivery design methodology for SoC on cost driven platforms

  • Author

    Cai, Kinger Xingjian ; Ji, Steven Yun

  • Author_Institution
    Intel Corporation, Santa Clara, CA, United States
  • fYear
    2015
  • fDate
    10-13 May 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A scalable power delivery analysis methodology is described for SoCs targeted at cost-driven platforms. The methodology is applied at different design stages to consolidate a hundred independent power supplies at bump level to half that at solder ball level and to five major power supplies at board level.
  • Keywords
    Couplings; Noise; Power supplies; Rails; Regulators; Routing; System-on-chip; cost driven SoC platform; power rails consolidation and isolation; scalable power delivery Design; small form factor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2015 IEEE 19th Workshop on
  • Conference_Location
    Berlin, Germany
  • Type

    conf

  • DOI
    10.1109/SaPIW.2015.7237389
  • Filename
    7237389
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2036152