Title :
Design optimization for electrical performance of a LFBGA package using EM-field simulation
Author :
Hunat, C. ; Tubulo, C. ; Chuen Khiang Wang ; Ren Liang ; Suthiwongsunthorn, Nathapong
Author_Institution :
United Test & Assembly Center Ltd., Singapore, Singapore
Abstract :
In this paper we presented methods of optimizing a 17×17mm LFBGA package having improve its electrical performance using an electromagnetic-field software through simulation, particularly on controlled signals (single-end & differential pairs) and high-speed I/O signal traces.
Keywords :
ball grid arrays; design engineering; electromagnetic fields; EM field simulation; LFBGA package; design optimization; electrical performance; electromagnetic field software; Conferences; Electronics packaging;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507188
