Title :
A new packaging technology for high-speed photoreceivers using micro-solder bumps
Author :
Tsunetsugu, Hideki ; Katsura, Kohsuke ; Hayashi, Tsuyoshi ; Ishitsuka, Fuminori ; Hata, Susumu ; Takachio, Noboru
Author_Institution :
NTT Electr. Commun. Lab., Tokyo, Japan
Abstract :
A novel packaging technology for high-speed photoreceivers with a photodiode and a preamplifier is presented. This technology features micro-solder bumps, an impedance-matched film (IPF) carrier, and an optical fiber unit. Micro-solder bumps eliminate parasitic elements of the interconnection between the photodiode and the preamplifier. The IPF carrier drastically reduces the parasitic inductive elements of the interconnection between the preamplifier and the package, and provides an impedance-matched interconnection. The optical fiber unit with hemispherical-lensed fibers carries out high-efficiency optical coupling. The photoreceiver using these technologies achieves 10 Gbit/s optical heterodyne transmission
Keywords :
flip-chip devices; optical communication equipment; optical couplers; packaging; receivers; 10 Gbit/s; hemispherical-lensed fibers; high-efficiency optical coupling; high-speed photoreceivers; impedance matched film carrier; impedance-matched film; impedance-matched interconnection; micro-solder bumps; optical fiber unit; optical heterodyne transmission; packaging technology; parasitic inductance reduction; photodiode; preamplifier; High speed optical techniques; Impedance; Optical coupling; Optical fibers; Optical films; Optical interconnections; Optical mixing; Packaging; Photodiodes; Preamplifiers;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163919
