DocumentCode
2039259
Title
3D simulations of an industrial ICP reactor with comparison to experimental data
Author
Kolobov, V. ; Ikeda, Ken-ichi ; Okumura, Takashi
Author_Institution
CFD Res. Corp., Huntsville, AL, USA
fYear
2003
fDate
5-5 June 2003
Firstpage
460
Abstract
Summary form only given, as follows. Coil design and gas flow patterns determine spatial uniformity of plasma and its composition in inductively coupled plasma (ICP) reactors for semiconductor manufacturing. Attempts of 3D ICP simulations have been reported over the last few years, however these simulations have remained a difficult and time-consuming task. We have performed 3D simulations of an industrial ICP reactor (Panasonic Pantheon E800 Dry Etcher) using a filament model to set up complicated multi-spiral RF coil and gas injectors.
Keywords
plasma materials processing; plasma simulation; semiconductor device manufacture; sputter etching; 3D simulations; Panasonic Pantheon E800 Dry Etcher; coil design; filament model; gas flow patterns; inductively coupled plasma; industrial ICP reactor; plasma spatial uniformity; semiconductor manufacturing; Coils; Dry etching; Fluid flow; Gas industry; Inductors; Manufacturing industries; Plasma applications; Plasma materials processing; Plasma simulation; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
Conference_Location
Jeju, South Korea
ISSN
0730-9244
Print_ISBN
0-7803-7911-X
Type
conf
DOI
10.1109/PLASMA.2003.1230053
Filename
1230053
Link To Document