• DocumentCode
    2039259
  • Title

    3D simulations of an industrial ICP reactor with comparison to experimental data

  • Author

    Kolobov, V. ; Ikeda, Ken-ichi ; Okumura, Takashi

  • Author_Institution
    CFD Res. Corp., Huntsville, AL, USA
  • fYear
    2003
  • fDate
    5-5 June 2003
  • Firstpage
    460
  • Abstract
    Summary form only given, as follows. Coil design and gas flow patterns determine spatial uniformity of plasma and its composition in inductively coupled plasma (ICP) reactors for semiconductor manufacturing. Attempts of 3D ICP simulations have been reported over the last few years, however these simulations have remained a difficult and time-consuming task. We have performed 3D simulations of an industrial ICP reactor (Panasonic Pantheon E800 Dry Etcher) using a filament model to set up complicated multi-spiral RF coil and gas injectors.
  • Keywords
    plasma materials processing; plasma simulation; semiconductor device manufacture; sputter etching; 3D simulations; Panasonic Pantheon E800 Dry Etcher; coil design; filament model; gas flow patterns; inductively coupled plasma; industrial ICP reactor; plasma spatial uniformity; semiconductor manufacturing; Coils; Dry etching; Fluid flow; Gas industry; Inductors; Manufacturing industries; Plasma applications; Plasma materials processing; Plasma simulation; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
  • Conference_Location
    Jeju, South Korea
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-7911-X
  • Type

    conf

  • DOI
    10.1109/PLASMA.2003.1230053
  • Filename
    1230053