Title :
E-kakashi project, an agri sensor network using ad hoc network technology
Author :
Yamaguchi, Norio ; Sakai, Yohei ; Shiraishi, Tatsuro ; Onishi, Shuhei ; Kowata, Takashi
Author_Institution :
Softbank Mobile Corp., Tokyo, Japan
Abstract :
E-kakashi project have implemented a sensor network for agriculture and an information platform called “e-kakashi system” using ad-hoc network technology and sensors. We also have built up several sensor gadgets e.g. (1) camera sensor gadget which can take infra-red automatically and send data using our ad-hoc network based on zigbee, (2) temperature, moisture sensors which are built in e-kakashi sensor pods. E-kakashi system is designed as an open system, so certified partners can develop the new sensor gadget using their own technology, and can connect it to the e-kakashi platform. In addition certified partner can store and access the data with API in the e-kakashi platform (data cloud) with secure manner. We show the relationship between e-kakashi information cloud and “Internet of things” from the view point of agricultural data and its use cases. E-kakashi project is supported by the Japan´s Ministry of Internal Affairs and Communications as “Ubiquitous Tokku” activity from 2009 to 2010.
Keywords :
ad hoc networks; agricultural engineering; application program interfaces; cameras; cloud computing; image sensors; information retrieval; infrared detectors; temperature sensors; wireless sensor networks; API; Internet of things; Zigbee network; ad hoc network technology; agri sensor network; agricultural data; agriculture sensor network; camera sensor; data access; e-kakashi information cloud; e-kakashi platform; e-kakashi project; e-kakashi sensor pods; information platform; moisture sensor; sensor gadgets; temperature sensor; Ad hoc networks; Agriculture; Business; Cameras; Cloud computing; Temperature sensors; ad-hoc; agriculture; cloud for agriculture; e-kakashi; internet of things; sensor network;
Conference_Titel :
SICE Annual Conference (SICE), 2011 Proceedings of
Conference_Location :
Tokyo
Print_ISBN :
978-1-4577-0714-8