Author :
Girardi, A. ; Conci, A. ; Izzi, R. ; Lessio, T. ; Canavero, F.G. ; Stievano, I.S. ; Dudek, H. ; Hardisty, D. ; Tarantini, M. ; Dieudonne, M. ; Hese, J. Van ; Cunha, T.R. ; Pedro, J.C. ; Gaquiere, Christopher ; Vellas, N.
Abstract :
This paper describes the research activity that is being carried out in the MOCHA project, a cooperative R&D effort at the European scale. The aim of the project is to develop reliable modelling and simulation solutions for SiP design verification.
Keywords :
integrated circuit design; system-in-package; SiP design verification; power integrity analysis; signal analysis; Analytical models; Electronic design automation and methodology; Electronics packaging; Integrated circuit modeling; Integrated circuit packaging; Performance evaluation; Power supplies; Power system modeling; Signal analysis; Signal design;
