DocumentCode :
2039950
Title :
Application of Thin-Film RCLG Model for the Modeling of Inkjet Printed Microstrip Lines
Author :
Lilja, Juha ; Makinen, Riku ; Pynttari, Vesa ; Mansikkamaki, Pauliina ; Kivikoski, Markku
Author_Institution :
Tampere Univ. of Technol., Tampere
fYear :
2008
fDate :
12-15 May 2008
Firstpage :
1
Lastpage :
4
Abstract :
Conductor thickness arising from printable electronics manufacturing technology is typically of the order of a skin depth in the frequency range from the upper UHF band to the lower SHF band. Modeling these conductors using standard circuit models however yield inaccurate results whereas full-wave modeling is very time consuming. In this paper, a circuit simulation model based on the surface resistance of a thin penetrable conductor is presented. The proposed model is validated by comparison with full-wave simulation results, Comparison with a conventional circuit-simulation model shows improved accuracy in the loss calculation.
Keywords :
ink jet printers; integrated circuit modelling; microstrip lines; surface resistance; SHF band; UHF band; circuit simulation; conductor thickness; inkjet printed microstrip lines; printable electronics manufacturing; surface resistance; thin penetrable conductor; thin-film RCLG model; Circuit simulation; Conducting materials; Conductivity; Conductors; Frequency; Microstrip; Skin; Software packages; Surface resistance; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
Electronic_ISBN :
978-1-4244-2318-7
Type :
conf
DOI :
10.1109/SPI.2008.4558369
Filename :
4558369
Link To Document :
بازگشت