Use of the SPP Technique to Account for Inhomogeneities in Differential Printed-Circuit-Board Wiring

Author

Deutsch, A. ; Krabbenhoft, Roger ; Surovic, C.W. ; Rubin, B. ; Winkel, T.-M.

Author_Institution

IBM T. J. Watson Res. Center, Yorktown Heights, NY

fYear

2008

fDate

12-15 May 2008

Firstpage

1

Lastpage

4

Abstract

The short-pulse propagation (SPP) time-domain technique is shown to be able to easily account for the inhomogeneities found in typical printed-circuit-board wiring. SPP is used to generate broadband predictive models for differential lines with different glass-fiber-to-epoxy-resin ratios and also for the soldermask layers used on top and bottom of typical boards. In both cases, a two-step extraction procedure is employed to obtain the broadband complex permittivity for the inhomogeneous structures and correlation with TDT measurements is used to validate the technique. Some examples of the effect of using different epoxy resin contents on the total loss are shown for 7.0 mil and 10.0 mil pitch differential wiring.

Keywords

permittivity; printed circuits; wiring; broadband complex permittivity; differential printed-circuit-board wiring; short-pulse propagation time-domain technique; Crosstalk; Epoxy resins; Glass; Insulation; Integrated circuit interconnections; Predictive models; Stripline; Time domain analysis; Wires; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on

Conference_Location

Avignon

Print_ISBN

978-1-4244-2317-0

Electronic_ISBN

978-1-4244-2318-7

Type

conf

DOI

10.1109/SPI.2008.4558375

Filename

4558375